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SUSS and Manz Asia Team Up to Bring Inkjet Precision to Advanced Semiconductor Packaging
Shared with SuperPrinters · 9/8/2026 · Source: screenprintindia.com
SUSS MicroTec and Manz Asia have announced a joint development partnership aimed at applying inkjet technology to semiconductor manufacturing and advanced packaging, including panel-level formats. The collaboration combines SUSS's semiconductor process expertise with Manz Asia's inkjet engineering capabilities to enable selective, additive material deposition on complex package surfaces. The approach could reduce material waste compared to conventional blanket coating methods, though the partners have yet to publish performance data or announce a commercial product.
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